產品簡介 Produsts Introduction

本機型為我公司專門為切割半導體矽片設計的一款機型，應用金剛石線切割，大切割幅麵為Φ300mm

（12 英寸）。該設備具有精密溫度控製係統，切片精度高，翹曲度小，切片質量穩定，切割成本低。

This series is specially designed for cutting semiconductor silicon wafers. The maximum cutting width is Φ300 mm (12 inches) with diamond wire cutting. It has a precise temperature 

control system, high slice precision, small warpage, stable slice quality and low cutting cost.

切割樣品 Cutting sample

機型特點Characteristics

技術參數 Parameter